This 2-layer rigid RF PCB is built with Rogers RO4533—a ceramic-filled, glass-reinforced hydrocarbon material—and features an Immersion Gold surface finish. Complying with IPC-Class 2 quality standards, this PCB provides consistent and reliable performance for critical applications such as cellular infrastructure base station antennas and WiMAX antenna networks. With a focus on low loss, dimensional stability, and compatibility with standard manufacturing processes, it stands out as the best choice for engineers and procurement teams seeking an affordable, high-performance substrate for mobile infrastructure microstrip antenna projects.
PCB Specifications
| Construction Item |
Details |
| Base Material |
RO4533 – A ceramic-filled, glass-reinforced hydrocarbon material |
| Layer Count |
2 layers – A rigid PCB structure optimized to support the performance of mobile infrastructure antennas and standard manufacturing processes |
| Board Dimensions |
123.5mm x 46mm (1PCS), with a tight tolerance of +/- 0.15mm |
| Trace & Space |
Minimum 4/5 mils, enabling the design of compact, fine-line circuits without compromising signal integrity |
| Minimum Hole Size |
0.25mm, suitable for the high-precision component mounting requirements |
| Vias |
No blind vias, which simplifies the manufacturing process while ensuring secure interlayer connections for reliable signal transmission |
| Finished Board Thickness |
0.6mm, offering robust mechanical stability while meeting the thickness requirements of cellular infrastructure antennas |
| Copper Weight |
1oz (1.4 mils) on outer layers (35μm), providing excellent conductivity for RF signals in mobile infrastructure applications |
| Via Plating Thickness |
20μm, adhering to IPC-Class 2 standards |
| Surface Finish |
Immersion Gold, which ensures excellent solderability, corrosion resistance, and long-term reliability for high-precision antenna assemblies |
| Silkscreen & Solder Mask |
Top Silkscreen: White; Bottom Silkscreen: No; Top Solder Mask: Green; Bottom Solder Mask: No |
| Quality Testing |
100% electrical testing is carried out prior to shipment, |
PCB Stack-up Configuration
| Stack-up Component |
Specifications & Description |
| Copper Layer 1 |
35μm – Ensures efficient signal transmission and thermal conductivity for cellular infrastructure antenna applications |
| Rogers 4533 Core |
0.508mm (20mil) – Acts as the foundation for the PCB’s superior low-loss performance, designed specifically for mobile infrastructure antennas |
| Copper Layer 2 |
35μm – Delivers consistent conductivity and symmetry to ensure balanced signal flow in RF antenna circuits |
RO4533 Substrate: The Key to Low-Loss, High-Performance Antenna Solutions
Rogers RO4533 laminate is the cornerstone of our PCB’s exceptional performance, specifically engineered to meet the demands of mobile infrastructure microstrip antenna applications:
Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon-based materials that deliver the controlled dielectric constant, low-loss performance, and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. These laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processing, eliminating the need for the special treatment required by traditional PTFE-based laminates for plated through-hole preparation. As an affordable alternative to more conventional PTFE antenna technologies, RO4533 enables designers to balance the price and performance of their antennas. Furthermore, RO4533 laminates are available in halogen-free versions to meet the most stringent “green” environmental standards.
The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for optimal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper, which reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low Z-axis CTE and excellent plated through-hole reliability.
Key Features of RO4533 PCB
RO4533 offers outstanding electrical and mechanical features specifically tailored for mobile infrastructure antenna applications, including:
Dielectric Constant (Dk): 3.3 at 10GHz – Ensures controlled, stable signal propagation for antenna applications
Dissipation Factor: 0.0025 at 10GHz – Low dielectric loss, which is critical for preserving signal integrity and antenna efficiency
Coefficient of Thermal Expansion (CTE): X-axis 13ppm/°C, Y-axis 11ppm/°C, Z-axis 37ppm/°C – Copper-matched X/Y CTE reduces thermal stress in antenna PCBs
Glass Transition Temperature (Tg): >280°C – Supports high-temperature processing and reliable operation in harsh environments
Low Moisture Absorption: 0.02% – Enhances reliability in humid operating conditions, making it ideal for outdoor antenna deployments
Thermal Conductivity: 0.6 W/mK – Facilitates efficient heat dissipation, improving power handling for antenna systems
Key Benefits of RO4533 PCB
The RO4533 substrate offers numerous advantages for engineers and manufacturers of mobile infrastructure antennas, including:
Low Loss, Low Dk, and low PIM response – Suitable for a wide range of mobile infrastructure antenna applications
Thermoset resin system – Compatible with standard PCB fabrication processes, reducing manufacturing complexity and costs
Excellent dimensional stability – Delivers higher yields on larger panel sizes, optimizing production efficiency
Uniform mechanical properties – Maintains its mechanical form during handling, ensuring consistent antenna performance
High thermal conductivity – Improves power handling capabilities, enhancing the reliability of antennas in high-power applications
Applications
Our RO4533 2-layer RF PCB is specifically engineered for low-loss, high-performance mobile infrastructure applications, including:
-Cellular infrastructure base station antennas
-WiMAX antenna networks
Artwork Format & Availability
Artwork Format: Supplied in Gerber RS-274-X – The industry-standard format for PCB manufacturing, ensuring compatibility with all major design and fabrication software and guaranteeing reliable production.
Availability: Worldwide – We offer global shipping to meet the needs of engineers and manufacturers around the world, with delivery times that comply with industry standards.
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High-Performance RO4533 PCB 20mil 2-Layer Low-Loss Solution Images
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