Looking for a high-performance 2-layer rigid RF PCB designed to meet the demands of challenging microwave, RF, and radar applications? This 2-layer rigid RF PCB is built with Wangling's F4BME217—a high-performance PTFE composite laminate—engineered to deliver superior, consistent electrical properties while satisfying the precision needs of high-frequency designs. Adhering to IPC-Class 2 quality standards, this PCB ensures reliable performance for critical applications such as satellite communication systems, base station antennas, phase shifters, and phased array antennas. With a strong focus on precision, low-loss performance, and design adaptability, it stands as the ideal option for engineers and procurement teams in search of a reliable, high-performance domestic substrate for high-precision RF and microwave projects.
PCB Specifications
| Construction Item | Details |
| Board Dimensions (2-layer RF PCB) | 102mm x 83mm (1PCS), with a tight tolerance of +/- 0.15mm to ensure a precise fit in your assembly setups |
| Trace & Space | Minimum 5/6 mils, facilitating compact, fine-line circuit design without compromising signal integrity |
| Minimum Hole Size | 0.25mm, compatible with standard component mounting needs for precision-focused RF applications |
| Vias | No blind vias, simplifying the manufacturing process while ensuring secure interlayer connections for high-frequency signal transmission |
| Finished Board Thickness | 1.3mm, delivering mechanical robustness while maintaining compatibility with high-precision RF assembly needs |
| Copper Weight | 1oz (1.4 mils) on outer layers (35μm), providing excellent conductivity for high-frequency RF and microwave signals |
| Via Plating Thickness | 20μm, complying with IPC-Class 2 standards to ensure reliable electrical connections and mechanical durability in harsh environments |
| Surface Finish | Bare copper, optimized for superior electrical performance, precise etching capabilities, and low conductor loss in high-precision RF designs |
| Silkscreen & Solder Mask | No top or bottom silkscreen; no top or bottom solder mask, ensuring a clean design that is optimized for high-frequency RF signal performance |
| Quality Testing | 100% electrical testing is conducted prior to shipment, guaranteeing functionality and eliminating defective units for reliable deployment |
PCB Stack-up Configuration
| Stack-up Component | Specifications & Description |
| Copper Layer 1 | 35μm – Ensures efficient signal transmission and thermal conductivity for high-frequency RF and microwave applications |
| F4BME217 Core | 1.0mm (39.37mil) – Serves as the foundation of the PCB’s superior electrical performance, engineered for demanding RF and microwave projects |
| Copper Layer 2 | 35μm – Provides consistent conductivity and symmetry for balanced signal flow in high-frequency RF circuits |
Artwork Format & Availability
Artwork Format: Gerber RS-274-X – The industry-standard format for PCB manufacturing, ensuring compatibility with all major design and fabrication software.
Availability: Worldwide – We provide global shipping to meet the needs of engineers and manufacturers across the globe, with delivery times that meet industry standards.
F4BME217 Substrate: The Key to Exceptional RF Performance
Wangling's F4BME217 PTFE composite laminate serves as the backbone of our PCB’s superior performance, engineered to meet the demands of challenging RF, microwave, and radar applications:
Wangling's F4BME217 is a high-performance PTFE composite laminate developed for demanding RF and microwave applications. Precisely formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties. As a next-generation material, it outperforms its predecessor F4BM220 by a significant margin, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It acts as a reliable, high-performance domestic alternative to comparable imported laminates.
F4BME217 is clad with Reverse-Treated Foil (RTF) copper. This configuration delivers superior low-PIM (Passive Intermodulation) performance, allows for more precise etching of fine-line circuits, and reduces conductor loss—making it ideal for high-precision RF and microwave designs where signal integrity is of utmost importance. Unlike traditional laminates, F4BME217 achieves a balance between electrical performance and mechanical robustness, making it a versatile option for a wide range of high-frequency applications.
Key Features and Benefits of F4BME217 PCB
The electrical and mechanical properties of F4BME217 are precisely adjusted by modifying the ratio of PTFE to fiberglass cloth within the composite, providing engineers with unique design flexibility:
Controlled Dielectric Constants – Adjusting the PTFE-to-fiberglass ratio allows for customized dielectric properties, enabling engineers to optimize designs for specific frequency requirements
Low Loss Characteristics – Maintains excellent low dielectric loss, which is critical for preserving signal integrity in high-frequency RF and microwave applications
Enhanced Dimensional Stability – Higher fiberglass content improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift—ensuring reliability across temperature changes
Balanced Performance Trade-Off – A higher fiberglass ratio boosts mechanical robustness and stability, with only a slight increase in dielectric loss, providing an optimal balance for various applications
Design Flexibility – Enables engineers to choose the optimal material grade to balance electrical performance, mechanical robustness, and processing requirements for their specific project needs
Superior Low-PIM Performance – Clad with RTF copper, which reduces passive intermodulation interference and enhances signal quality in high-precision RF systems
Applications
Our F4BME217 2-layer RF PCB is specifically designed for challenging high-frequency, high-precision applications, including:
- Microwave, RF, and Radar systems
- Phase Shifters and Passive Components
- Power Dividers, Couplers, and Combiners
- Feed Networks and Phased Array Antennas
- Satellite Communication systems
- Base Station Antennas
