This high-performance 2-layer PCB is constructed with Rogers RT/duroid 6006—a ceramic-PTFE composite engineered for electronic and microwave applications requiring high dielectric constant (Dk) and low loss. Designed to enable circuit size reduction while maintaining repeatable performance, it adheres to IPC-Class-2 standards and is optimized for X-band and below operations.
PCB Specification
| Parameter | Details |
| Base Material | Rogers RT/duroid 6006 (ceramic-PTFE composite) |
| Layer Count | 2-Layer rigid PCB |
| Board Dimensions | 43mm x 107.5mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.2mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.35mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (enhanced conductivity, corrosion resistance) |
| Silkscreen | Top: Black; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type | Material/Description | Thickness |
| Copper Layer 1 (Outer) | Conductive electrodeposited copper (finished) | 35 μm (1oz) |
| Dielectric Layer | Rogers RT/duroid 6006 | 0.254 mm (10 mils) |
| Copper Layer 2 (Outer) | Conductive electrodeposited copper (finished) | 35 μm (1oz) |
Material Overview: Rogers RT/duroid 6006
Rogers RT/duroid 6006 is a premium ceramic-PTFE composite laminate tailored for microwave and electronic circuits demanding high dielectric constant. Its unique formulation delivers low electrical loss, making it ideal for X-band and lower frequency applications, while tight control over Dk and thickness ensures consistent, repeatable circuit performance.
Key Material Features
| Specification | Value |
| Material Type | Ceramic-PTFE composite |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10 GHz / 23°C |
| Dissipation Factor (tanδ) | 0.0027 at 10 GHz / 23°C |
| Thermal Stability (Td, TGA) | >500 °C |
| Moisture Absorption | 0.05% |
| Coefficient of Thermal Expansion (CTE) - X-axis | 47 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Y-axis | 34 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Z-axis | 117 ppm/°C |
| Copper Foil Type | Standard/reverse treated electrodeposited |
| Flammability Rating | UL 94-V0 |
| Lead-Free Compatibility | Yes |
Core Benefits
Circuit Miniaturization: High Dk (6.15) enables significant reduction in board size without compromising performance.
Low Loss Performance: Ideal for X-band and below applications, ensuring efficient signal transmission with minimal attenuation.
Repeatable Reliability: Tight Dk and thickness control guarantees consistent performance across production runs.
Moisture Resilience: Low moisture absorption (0.05%) ensures stability in humid or harsh environments.
Manufacturing Flexibility: Compatible with lead-free processes and reliable for plated through-holes (supports multi-layer scalability).
Typical Applications
This PCB is engineered for high-reliability, space-constrained systems, including:
-Patch Antennas
-Satellite Communications Systems
-Power Amplifiers
-Aircraft Collision Avoidance Systems
-Ground Radar Warning Systems
This RT duroid 6006 PCB is available worldwide. Contact us if you have any project requirement.
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RT duroid 6006 PCB Rogers 10mil Laminate Black Silkscreen Images
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