Sign In | Join Free | My futurenowinc.com
China Bicheng Electronics Technology Co., Ltd logo
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Verified Supplier

6 Years

Home > Multi Layer PCB >

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Brand Name : Bicheng

Model Number : BIC-332.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RO4350B + High Tg FR-4 (S1000-2M)

Layer count : 6 layers

PCB thickness : 1.3mm

PCB size : 30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm

Silkscreen : White

Solder mask : Green

Copper weight : 1oz (1.4 mils) for inner/outter layers

Surface finish : Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

Contact Now

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter Specification
Base Material RO4350B + High Tg FR-4 (S1000-2M)
Layer Count 6-layer
Board Dimensions 30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space 4 mils / 4 mils
Minimum Hole Size 0.25mm
Vias (Special Types) Blind vias (L1-L2)
Finished Board Thickness 1.3mm
Finished Copper Weight (Inner/Outer Layers) 1oz (1.4 mils)
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask No
Bottom Solder Mask Green
Quality Assurance (Electrical Testing) 100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence Layer Type Specification Thickness
1 Copper Layer (Top) Copper_layer_1 35 μm
2 Laminate RO4350B 0.102mm (4mil)
3 Copper Layer Copper_layer_2 35 μm
4 Prepreg 1080 RC63% + 7628 (43%) 0.254mm (10mil)
5 Copper Layer Copper_layer_3 35 μm
6 Core Material S1000-2M 0.254mm (10mil)
7 Copper Layer Copper_layer_4 35 μm
8 Prepreg 1080 RC63% + 7628 (43%) 0.254mm (10mil)
9 Copper Layer Copper_layer_5 35 μm
10 Core Material S1000-2M 0.254mm (10mil)
11 Copper Layer (Bottom) Copper_layer_6 35 μm

What is a Hybrid PCB?

A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Rogers RO4350B Material Overview

Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.

Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss—all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.

RO4350B Properties

Property Specification
Material Type Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk) 3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df) 0.0037 (measured at 10GHz/23°C)
Thermal Conductivity 0.69 W/m/°K
Coefficient of Thermal Expansion (CTE) X-axis: 10 ppm/°CY-axis: 12 ppm/°CZ-axis: 32 ppm/°C
Glass Transition Temperature (Tg) >280°C (536°F)
Moisture Absorption 0.06% (max)
Flammability Rating UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

-Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments

-Superior mechanical processability paired with exceptional thermal resistance

-Lead-free soldering compatibility, aligning with modern manufacturing standards

-Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility

-Outstanding high-heat endurance for stable performance in elevated temperature conditions

-Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks

-Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

-Commercial Airline Broadband Antennas

-Microstrip and Stripline Circuits

-Millimeter Wave Systems

-Radar & Guidance Systems

-Point-to-Point Digital Radio Antennas

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias


Product Tags:

6-layer hybrid PCB RO4350B

      

high Tg FR-4 PCB

      

blind vias multilayer PCB

      
Wholesale 6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias from china suppliers

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)